KITA RESEARCH GROUP - Functional Ultrathin Film Engineering -
MESSAGE
Welcome!
Material engineering for functionality design of the nano-scaled ultrathin
films and their hetero-interfaces is now having a crucial role in the development
of advanced electron devices. Our researches are focusing on designing
the electric / magnetic / optical functions of device materials and their
stacks, especially for development of highly-efficient energy conversion
power devices and ultralow-power consuming nano-electron devices, toward
the future energy-saving society.
Koji KITA
Associate Professor
7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656 Japan, The University of Tokyo,
Engineering Building #4-441
TEL/FAX +81-3-5841-7164
kita(at)scio.t.u-tokyo.ac.jp
WHY DON'T YOU JOIN US? 仛 Your visit is anytime welcomed at Room #441 in engineering bld.#4. Please contact Prof. Kita before your visit.
NEWS
We are going to have a workshop "SiC MOS Interface mini workshop at University of Tokyo" on Nov. 15, with a special lecture by Prof. Leonard Feldman from Rutgers
University (at Seminar room 205 in Engineering Build. #4, from 2pm). Please
see here for the information in detail. Those who are interested in material science of semiconductor interfaces
are welcomed to join. See also the access to Build. #4.
We presented several papers at the series of conferences in Sep. and Oct:
Two oral presentations at SSDM2019 at Nagoya, three oral presentations
at OUBUTSU(JSAP bi-annual meeting) at Sapporo, and three papers at ICSCRM2019
at Kyoto. See our publications Cereblating graduation:Dr. Adhi Dwi Hatmanto has completed his phD course,
and Qiao Chu has finished her master's program. See our gallery Prof. Kita made an oral presentation at IWGO-3 (The 3rd International Workshop
on Gallium Oxide and Other Related Materials)@Columbus, OH, USA. (Aug 2019)
See our publications
We are going to have a workshop "SiC MOS Interface mini workshop at University of Tokyo" on Nov. 15, with a special lecture by Prof. Leonard Feldman from Rutgers
University (at Seminar room 205 in Engineering Build. #4, from 2pm). Please
see
We presented several papers at the series of conferences in Sep. and Oct:
Two oral presentations at SSDM2019 at Nagoya, three oral presentations
at OUBUTSU(JSAP bi-annual meeting) at Sapporo, and three papers at ICSCRM2019
at Kyoto. 
Coming Conferences Information